Infinix Hot 8 vs Xiaomi MI-3

Compare recorded specifications, size and practical differences.

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Key differences

Calculated from recorded specifications using minimum difference thresholds. These are differences, not an overall ranking. For three phones, numeric highlights compare the two extremes.

  • Weight

    MI-3: 34 g lighter

    Hot 8:
    179 g
    MI-3:
    145 g
  • Width

    MI-3: 2.7 mm narrower

    Hot 8:
    76.3 mm
    MI-3:
    73.6 mm
  • Screen diagonal

    MI-3: 1.52 in smaller diagonal

    Hot 8:
    6.52 in
    MI-3:
    5 in
  • Memory variants

    At 64 GB storage

    Hot 8:
    4 GB RAM
    MI-3:
    2 GB RAM
  • Rear camera layout

    Hot 8:
    Triple
    MI-3:
    Single
  • Depth

    MI-3: 0.6 mm thinner

    Hot 8:
    8.7 mm
    MI-3:
    8.1 mm

Physical size

Relative size, not calibrated actual size. Front and side outlines share one scale and a bottom baseline. Generic outlines use recorded body dimensions, excluding camera bumps.

  1. 1. Hot 8

    Height:
    165 mm +21 mm versus MI-3
    Width:
    76.3 mm +2.7 mm versus MI-3
    Depth:
    8.7 mm +0.6 mm versus MI-3
  2. 2. MI-3

    Height:
    144 mm
    Width:
    73.6 mm
    Depth:
    8.1 mm

Weight

Bars start at zero and share a scale within this chart.

  1. 1. Hot 8

    179 g

    +34 g versus MI-3

  2. 2. MI-3

    145 g

Screen size

Approximate rectangular screens calculated from recorded diagonal and aspect ratio at one relative scale. Rounded corners and cutouts are not subtracted. These are not phone outlines or calibrated actual sizes.

  1. 1. Hot 8

    Screen diagonal:
    6.52 in
    Aspect ratio (height:width):
    20:9
    Approximate rectangular screen area:
    102.6 cm²
  2. 2. MI-3

    Screen diagonal:
    5 in
    Aspect ratio (height:width):
    16:9
    Approximate rectangular screen area:
    68.9 cm²

Hot 8 has approximately 48.9% more rectangular screen area than MI-3.

Memory variants

Each row compares the same storage capacity. Cells show recorded RAM alternatives, not combined maxima. Not recorded does not mean unavailable in every market.

Recorded RAM for Hot 8, MI-3, compared at the same storage capacity.
StorageHot 8MI-3
16 GB Not recorded 2 GB RAM
32 GB 2 GB RAM Not recorded
64 GB Recorded for all phones 4 GB RAM 2 GB RAM

Practical features

Explicit Yes and No values are shown directly. Qualified or regional records retain their details. Unknown means the record is missing.

1. Hot 8

NFC:
Unknown
Headphone jack:
Yes
Memory card support:
See details microSD · up to 256 GB (dedicated slot)

2. MI-3

NFC:
Yes
Headphone jack:
Yes
Memory card support:
No

Battery capacity

Capacity is not battery life. No endurance test is implied.

Recorded battery capacity

Bars start at zero and share a scale within this chart.

  1. 1. Hot 8

    5000 mAh

    +1950 mAh versus MI-3

  2. 2. MI-3

    3050 mAh

Specifications

Open a section for more detail. On narrow screens, swipe sideways or use Left/Right arrow keys while the table is focused. Unknown means missing data, not No. Recorded zero values are shown as recorded.

1. Hot 82. MI-3

Everyday essentials
Everyday essentials — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Dimensions (HxWxD)
  • 165 Х 76.3 Х 8.7 mm
  • 144 Х 73.6 Х 8.1 mm
Weight
  • 179 g
  • 145 g
Technology
  • IPS LCD
  • IPS LCD
Screen size
  • 6.52" inch
  • 5" inch
Screen resolution
  • 720 x 1600 px
  • 1080 x 1920 px
Internal memory Recorded storage / RAM variants. Entries are alternatives, not a combined maximum. Ambiguous formats stay as recorded.
  • 32GB 2GB RAM
  • 64GB 4GB RAM
  • 16/64 GB
  • 2 GB RAM
Memory card support
  • microSD
  • up to 256 GB (dedicated slot)
  • No
Battery Capacity is not battery life. No endurance test is implied.
  • 5000 mAh
  • Non-removable Li-Po
  • 3050 mAh
  • Non-removable Li-Ion
Operating system OS
  • Android 9.0 (Pie)
  • XOS 5.0
  • Android 4.3 (Jelly Bean)
  • upgradable to 6.0 (Marshmallow); MIUI 5
Chipset
  • Mediatek MT6761 Helio A22 (12 nm) 32/2 GB -Mediatek MT6762 Helio P22 (12 nm) 64/4 GB
  • Qualcomm MSM8274AB Snapdragon 800 (28 nm)
NFC Unknown
  • Yes
Headphone jack
  • Yes
  • Yes
Display
Display — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Touchscreen
  • capacitive touchscreen
  • capacitive touchscreen
Display colors
  • 16M
  • 16M
Screen area
  • 102.6 cm2
  • 68.9 cm2
Screen format
  • 20:9 (height:width)
  • 16:9 (height:width)
Screen to body ratio
  • 81.5%
  • 65.0%
PPI /points per inch/
  • 269 PPI
  • 441 PPI
Screen protection Unknown
  • Corning Gorilla Glass 3
Camera and Video
Camera and Video — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Rear camera, main
  • 13 MP
  • Triple
  • 13 MP
  • Single
Camera specs
  • 13 MP
  • f/1.8
  • 26mm (wide)
  • 1/3.1''
  • 1.12µm
  • PDAF -2 MP
  • depth sensor -QVGA (Low light sensor)
  • 13 MP
  • f/2.2
  • 28mm (wide)
  • AF
Functions
  • LED flash
  • Dual-LED flash
  • HDR
Video
  • 1080p@30fps
  • 1080p@30fps
Front camera, selfie
  • 8 MP
  • Single
  • 2 MP
  • Single
Specifications
  • 8 MP
  • f/2.0
  • 25mm (wide)
  • 2 MP
  • f/2.2
Performance

Scores marked * are historical catalogue entries. Test conditions are unspecified; no new testing is implied.

Performance — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Processor CPU
  • Quad-core 2.0 GHz Cortex-A53 -Octa-core 1.8 GHz Cortex-A53
  • Quad-core 2.3 GHz Krait 400
Graphics processor GPU
  • PowerVR GE8320
  • Adreno 330
Antutu 7 score *
  • 76322
  • 55192
General specs
General specs — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Release date
  • 2019
  • September
  • 2013
  • September
Colors
  • Quetzal Cyan
  • Cosmic Purple
  • Shark Grey
  • Midnight Black
  • White
  • Gray
  • Black
  • Yellow
  • Pink
  • Blue
  • Gold
  • Green (16 GB)
Historical recorded price Legacy catalogue value; date unknown. Not a current offer.
  • 7000 INR
  • 200 EUR
Battery life Unknown
  • Stand by time- Up to 500 h Talking time- Up to 25 h Music play - Up to 50 h
Body build
  • Front/back glass
  • plastic body
Communication and Connectivity
Communication and Connectivity — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
SIM card
  • Dual SIM (Nano-SIM
  • dual stand-by)
  • Mini-SIM
Network
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 -3G - HSDPA 850 / 900 / 2100 -4G - LTE band 1(2100)
  • 3(1800)
  • 5(850)
  • 8(900)
  • 38(2600)
  • 40(2300)
  • 41(2500)
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900
Speed
  • HSPA 42.2/5.76 Mbps
  • LTE Cat4 150/50 Mbps
  • HSPA 42.2/5.76 Mbps
GPRS
  • Yes
  • Yes
Edge
  • Yes
  • Yes
Wi-Fi
  • Wi-Fi 802.11 a/b/g/n/ac
  • dual-band
  • Wi-Fi Direct
  • hotspot
  • Wi-Fi 802.11 a/b/g/n
  • dual-band
  • Wi-Fi Direct
  • hotspot
GPS
  • Yes
  • with A-GPS
  • Yes
  • with A-GPS
  • GLONASS
USB
  • microUSB 2.0
  • USB On-The-Go
  • microUSB 2.0
  • USB Host
Bluetooth
  • 5.0
  • A2DP
  • LE
  • 4.0
  • A2DP
Music and Audio
Music and Audio — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Radio
  • FM radio
  • FM radio
Others
  • Dirac Surround Sound
  • Active noise cancellation with dedicated mic
Other features
Other features — specifications for Hot 8, MI-3.
SpecificationHot 8MI-3
Dop
  • Sensors Fingerprint (rear-mounted)
  • accelerometer
  • proximity
  • compass
  • Sensors Accelerometer
  • gyro
  • proximity
  • compass
  • barometer - Fast battery charging (Quick Charge 2.0)