LG G8s ThinQ vs Orange Hiro

Compare recorded specifications, size and practical differences.

+ Add a third phone

Key differences

Calculated from recorded specifications using minimum difference thresholds. These are differences, not an overall ranking. For three phones, numeric highlights compare the two extremes.

  • Display technology

    OLED versus LCD

    G8s ThinQ:
    OLED
    Hiro:
    LCD
  • Weight

    Hiro: 85 g lighter

    G8s ThinQ:
    181 g
    Hiro:
    96 g
  • Width

    Hiro: 15 mm narrower

    G8s ThinQ:
    77 mm
    Hiro:
    62 mm
  • Screen diagonal

    Hiro: 1.91 in smaller diagonal

    G8s ThinQ:
    6.21 in
    Hiro:
    4.3 in
  • Chipset

    G8s ThinQ:
    Qualcomm SDM855 Snapdragon 855 (7 nm)
    Hiro:
    Mediatek MT6572 (28 nm)
  • Rear camera layout

    G8s ThinQ:
    Triple
    Hiro:
    Single

Physical size

Relative size, not calibrated actual size. Front and side outlines share one scale and a bottom baseline. Generic outlines use recorded body dimensions, excluding camera bumps.

  1. 1. G8s ThinQ

    Height:
    155 mm +27.9 mm versus Hiro
    Width:
    77 mm +15 mm versus Hiro
    Depth:
    8 mm
  2. 2. Hiro

    Height:
    127.1 mm
    Width:
    62 mm
    Depth:
    8 mm

Weight

Bars start at zero and share a scale within this chart.

  1. 1. G8s ThinQ

    181 g

    +85 g versus Hiro

  2. 2. Hiro

    96 g

Screen size

Approximate rectangular screens calculated from recorded diagonal and aspect ratio at one relative scale. Rounded corners and cutouts are not subtracted. These are not phone outlines or calibrated actual sizes.

At least two phones need compatible screen dimensions for a drawing.

  1. 1. G8s ThinQ

    G8s ThinQ: Screen geometry unavailable or conflicting.

  2. 2. Hiro

    Screen diagonal:
    4.3 in
    Aspect ratio (height:width):
    16:9
    Approximate rectangular screen area:
    51 cm²

Memory variants

Each row compares the same storage capacity. Cells show recorded RAM alternatives, not combined maxima. Not recorded does not mean unavailable in every market.

No unambiguous storage/RAM pairings are recorded. See the original specifications below.

G8s ThinQ: Original memory entry

128 GB · 6 GB RAM or 64 GB · 6 GB RAM (Korea only)

Hiro: Original memory entry

4 GB · 512 MB RAM

Practical features

Explicit Yes and No values are shown directly. Qualified or regional records retain their details. Unknown means the record is missing.

1. G8s ThinQ

NFC:
Yes
Headphone jack:
Yes
Memory card support:
See details microSD · up to 512 GB (dedicated slot) - single-SIM modelmicroSD · up to 512 GB (uses SIM 2 slot) - d

2. Hiro

NFC:
Unknown
Headphone jack:
Yes
Memory card support:
See details microSD · up to 32 GB (dedicated slot)

Battery capacity

Capacity is not battery life. No endurance test is implied.

Recorded battery capacity

Bars start at zero and share a scale within this chart.

  1. 1. G8s ThinQ

    3550 mAh

    +1850 mAh versus Hiro

  2. 2. Hiro

    1700 mAh

Specifications

Open a section for more detail. On narrow screens, swipe sideways or use Left/Right arrow keys while the table is focused. Unknown means missing data, not No. Recorded zero values are shown as recorded.

1. G8s ThinQ2. Hiro

Everyday essentials
Everyday essentials — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Dimensions (HxWxD)
  • 155 Х 77 Х 8 mm
  • 127.1 Х 62 Х 8 mm
Weight
  • 181 g
  • 96 g
Technology
  • G-OLED
  • IPS LCD
Screen size
  • 6.21" inch
  • 4.3" inch
Screen resolution
  • 1080 x 2248 px
  • 480 x 854 px
Internal memory Recorded storage / RAM variants. Entries are alternatives, not a combined maximum. Ambiguous formats stay as recorded.
  • 128 GB
  • 6 GB RAM or 64 GB
  • 6 GB RAM (Korea only)
  • 4 GB
  • 512 MB RAM
Memory card support
  • microSD
  • up to 512 GB (dedicated slot) - single-SIM modelmicroSD
  • up to 512 GB (uses SIM 2 slot) - d
  • microSD
  • up to 32 GB (dedicated slot)
Battery Capacity is not battery life. No endurance test is implied.
  • 3550 mAh
  • Non-removable Li-Po
  • 1700 mAh
  • Removable Li-Ion
Operating system OS
  • Android 9.0 (Pie);
  • Android 4.1 (Jelly Bean)
Chipset
  • Qualcomm SDM855 Snapdragon 855 (7 nm)
  • Mediatek MT6572 (28 nm)
NFC
  • Yes
Unknown
Headphone jack
  • Yes
  • Yes
Display
Display — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Touchscreen
  • capacitive touchscreen
  • capacitive touchscreen
Display colors
  • 16M
  • 16M
Screen area
  • 97.6 cm2
  • 51.0 cm2
Screen format Unknown
  • 16:9 (height:width)
Screen to body ratio
  • 82%
  • 64.7%
PPI /points per inch/
  • 401 PPI
  • 228 PPI
Screen protection
  • Corning Gorilla Glass 5
Unknown
Camera and Video
Camera and Video — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Rear camera, main
  • 12 MP
  • Triple
  • 5 MP
  • Single
Camera specs
  • 12 MP
  • f/1.8
  • 27mm (standard)
  • 1.4µm
  • PDAF
  • OIS - 12 MP
  • f/2.6
  • 49mm (telephoto)
  • 1.0µm
  • 2x optical zoom - 13 MP
  • f/2.4
  • 14mm (ultrawide)
  • 5 MP
  • AF
Functions
  • HDR
  • LED flash
Video
  • 1080p@60fps
  • 720p
Front camera, selfie
  • 8 MP
  • Dual
  • 0.3 MP
  • Single
Specifications
  • 8 MP
  • f/1.9
  • 26mm (wide)
  • 1.12µm
  • AF TOF 3D camera
  • f/1.4
Unknown
Performance

Scores marked * are historical catalogue entries. Test conditions are unspecified; no new testing is implied.

Performance — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Processor CPU
  • Octa-core (1x2.84 GHz Kryo 485 & 3x2.42 GHz Kryo 485 & 4x1.79 GHz Kryo 485)
  • Dual-core 1.3 GHz Cortex-A7
Graphics processor GPU
  • Adreno 640
  • Mali-400
GeekBench 4 Single Core * Unknown
  • 317
GeekBench 4 Multi-Core * Unknown
  • 569
Antutu 8 score *
  • 421607
Unknown
GeekBench 5 Single Core *
  • 709
Unknown
GeekBench 5 Multi-Core *
  • 2546
Unknown
General specs
General specs — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Release date
  • 2019
  • February
  • 2013
  • Q3
Colors
  • Mirror Black
  • Mirror Teal
  • Mirror White
  • Carmine Red
  • New Aurora Black
  • New Moroccan Blue
  • Black
Historical recorded price Legacy catalogue value; date unknown. Not a current offer.
  • 770 EUR
Unknown
Body build
  • Front glass (Gorilla Glass 5)
  • Back glass (Gorilla Glass 6)
  • aluminum frame
Unknown
Communication and Connectivity
Communication and Connectivity — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
SIM card
  • Single SIM (Nano-SIM)Hybrid Dual SIM (Nano-SIM
  • dual stand-by)
  • Yes
Network
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 (dual-SIM model only) -3G - HSDPA 850 / 900 / 1700(AWS) / 1800 / 1900 / 2100 -4G - LTE band 1(2100)
  • 2(1900)
  • 3(1800)
  • 4(1700/2100)
  • 5(850)
  • 7(2600)
  • 8(900)
  • 12(700)
  • 17(700)
  • 20(800)
  • 28(700)
  • 32(1500)
  • 38(2600)
  • 39(1900)
  • 40(2300)
  • 41(2500)
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900
Speed
  • HSPA 42.2/5.76 Mbps
  • LTE-A
  • HSPA
GPRS
  • Yes
  • Yes
Edge
  • Yes
  • Yes
Wi-Fi
  • Wi-Fi 802.11 a/b/g/n/ac
  • dual-band
  • Wi-Fi Direct
  • DLNA
  • hotspot
  • Wi-Fi 802.11 b/g/n
  • hotspot
GPS
  • Yes
  • with A-GPS
  • GLONASS
  • GALILEO
  • BDS
  • Yes
  • with A-GPS
USB
  • 3.1
  • Type-C 1.0 reversible connector
  • USB On-The-Go
  • microUSB 2.0
Bluetooth
  • 5.0
  • A2DP
  • LE
  • aptX HD
  • Yes
Harmful irradiation Unknown
  • SAR EU - 1.29 W/kg (head)
Music and Audio
Music and Audio — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Radio
  • FM radio
  • No
Others
  • 100% DCI-P3 -Dolby Vision -HDR10 -Always-on display
  • 32-bit/192kHz audio -DTS: X Surround Sound -Active noise cancellation with dedicated mic
Unknown
Other features
Other features — specifications for G8s ThinQ, Hiro.
SpecificationG8s ThinQHiro
Dop
  • Sensors Fingerprint (rear-mounted)
  • accelerometer
  • gyro
  • proximity
  • compass
  • barometer - Fast battery charging 18W (Quick Charge 3.0) -Wireless charging
  • Sensors Accelerometer
  • proximity