LG G8s ThinQ vs Xiaomi Mi Max

Compare recorded specifications, size and practical differences.

+ Add a third phone

Key differences

Calculated from recorded specifications using minimum difference thresholds. These are differences, not an overall ranking. For three phones, numeric highlights compare the two extremes.

  • Display technology

    OLED versus LCD

    G8s ThinQ:
    OLED
    Mi Max:
    LCD
  • Weight

    G8s ThinQ: 22 g lighter

    G8s ThinQ:
    181 g
    Mi Max:
    203 g
  • Width

    G8s ThinQ: 11.3 mm narrower

    G8s ThinQ:
    77 mm
    Mi Max:
    88.3 mm
  • Screen diagonal

    G8s ThinQ: 0.23 in smaller diagonal

    G8s ThinQ:
    6.21 in
    Mi Max:
    6.44 in
  • Chipset

    G8s ThinQ:
    Qualcomm SDM855 Snapdragon 855 (7 nm)
    Mi Max:
    Qualcomm MSM8956 Snapdragon 650 -Qualcomm MSM8976 Snapdragon 652 (28 nm) Prime model
  • Rear camera layout

    G8s ThinQ:
    Triple
    Mi Max:
    Single

Physical size

Relative size, not calibrated actual size. Front and side outlines share one scale and a bottom baseline. Generic outlines use recorded body dimensions, excluding camera bumps.

  1. 1. G8s ThinQ

    Height:
    155 mm
    Width:
    77 mm
    Depth:
    8 mm +0.5 mm versus Mi Max
  2. 2. Mi Max

    Height:
    173.1 mm +18.1 mm versus G8s ThinQ
    Width:
    88.3 mm +11.3 mm versus G8s ThinQ
    Depth:
    7.5 mm

Weight

Bars start at zero and share a scale within this chart.

  1. 1. G8s ThinQ

    181 g

  2. 2. Mi Max

    203 g

    +22 g versus G8s ThinQ

Screen size

Approximate rectangular screens calculated from recorded diagonal and aspect ratio at one relative scale. Rounded corners and cutouts are not subtracted. These are not phone outlines or calibrated actual sizes.

At least two phones need compatible screen dimensions for a drawing.

  1. 1. G8s ThinQ

    G8s ThinQ: Screen geometry unavailable or conflicting.

  2. 2. Mi Max

    Screen diagonal:
    6.44 in
    Aspect ratio (height:width):
    16:9
    Approximate rectangular screen area:
    114.3 cm²

Memory variants

Each row compares the same storage capacity. Cells show recorded RAM alternatives, not combined maxima. Not recorded does not mean unavailable in every market.

No unambiguous storage/RAM pairings are recorded. See the original specifications below.

G8s ThinQ: Original memory entry

128 GB · 6 GB RAM or 64 GB · 6 GB RAM (Korea only)

Mi Max: Original memory entry

16 GB · 2 GB RAM; 32/64 GB · 3 GB RAM128 GB · 4 GB RAM - Prime model

Practical features

Explicit Yes and No values are shown directly. Qualified or regional records retain their details. Unknown means the record is missing.

1. G8s ThinQ

NFC:
Yes
Headphone jack:
Yes
Memory card support:
See details microSD · up to 512 GB (dedicated slot) - single-SIM modelmicroSD · up to 512 GB (uses SIM 2 slot) - d

2. Mi Max

NFC:
Unknown
Headphone jack:
Yes
Memory card support:
See details microSD · up to 256 GB (uses SIM 1 slot)

Battery capacity

Capacity is not battery life. No endurance test is implied.

Recorded battery capacity

Bars start at zero and share a scale within this chart.

  1. 1. G8s ThinQ

    3550 mAh

  2. 2. Mi Max

    4850 mAh

    +1300 mAh versus G8s ThinQ

Specifications

Open a section for more detail. On narrow screens, swipe sideways or use Left/Right arrow keys while the table is focused. Unknown means missing data, not No. Recorded zero values are shown as recorded.

1. G8s ThinQ2. Mi Max

Everyday essentials
Everyday essentials — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Dimensions (HxWxD)
  • 155 Х 77 Х 8 mm
  • 173.1 Х 88.3 Х 7.5 mm
Weight
  • 181 g
  • 203 g
Technology
  • G-OLED
  • IPS LCD
Screen size
  • 6.21" inch
  • 6.44" inch
Screen resolution
  • 1080 x 2248 px
  • 1080 x 1920 px
Internal memory Recorded storage / RAM variants. Entries are alternatives, not a combined maximum. Ambiguous formats stay as recorded.
  • 128 GB
  • 6 GB RAM or 64 GB
  • 6 GB RAM (Korea only)
  • 16 GB
  • 2 GB RAM; 32/64 GB
  • 3 GB RAM128 GB
  • 4 GB RAM - Prime model
Memory card support
  • microSD
  • up to 512 GB (dedicated slot) - single-SIM modelmicroSD
  • up to 512 GB (uses SIM 2 slot) - d
  • microSD
  • up to 256 GB (uses SIM 1 slot)
Battery Capacity is not battery life. No endurance test is implied.
  • 3550 mAh
  • Non-removable Li-Po
  • 4850 mAh
  • Non-removable Li-Ion
Operating system OS
  • Android 9.0 (Pie);
  • Android 6.0 (Marshmallow)
  • upgradable to 7.0 (Nougat); MIUI 10
Chipset
  • Qualcomm SDM855 Snapdragon 855 (7 nm)
  • Qualcomm MSM8956 Snapdragon 650 -Qualcomm MSM8976 Snapdragon 652 (28 nm) Prime model
NFC
  • Yes
Unknown
Headphone jack
  • Yes
  • Yes
Display
Display — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Touchscreen
  • capacitive touchscreen
  • capacitive touchscreen
Display colors
  • 16M
  • 16M
Screen area
  • 97.6 cm2
  • 114.3 cm2
Screen format Unknown
  • 16:9 (height:width)
Screen to body ratio
  • 82%
  • 74.8%
PPI /points per inch/
  • 401 PPI
  • 342 PPI
Screen protection
  • Corning Gorilla Glass 5
  • Corning Gorilla Glass 4
Camera and Video
Camera and Video — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Rear camera, main
  • 12 MP
  • Triple
  • 16 MP
  • Single
Camera specs
  • 12 MP
  • f/1.8
  • 27mm (standard)
  • 1.4µm
  • PDAF
  • OIS - 12 MP
  • f/2.6
  • 49mm (telephoto)
  • 1.0µm
  • 2x optical zoom - 13 MP
  • f/2.4
  • 14mm (ultrawide)
  • 16 MP
  • PDAF
  • f/2.0
Functions
  • HDR
  • Dual-LED dual-tone flash
  • panorama
  • HDR
Video
  • 1080p@60fps
  • 1080p@30fps
Front camera, selfie
  • 8 MP
  • Dual
  • 5 MP
  • Single
Specifications
  • 8 MP
  • f/1.9
  • 26mm (wide)
  • 1.12µm
  • AF TOF 3D camera
  • f/1.4
  • 5 MP
  • f/2.0
Performance

Scores marked * are historical catalogue entries. Test conditions are unspecified; no new testing is implied.

Performance — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Processor CPU
  • Octa-core (1x2.84 GHz Kryo 485 & 3x2.42 GHz Kryo 485 & 4x1.79 GHz Kryo 485)
  • Hexa-core (4x1.4 GHz Cortex-A53 & 2x1.8 GHz Cortex-A72) -Octa-core (4x1.4 GHz Cortex-A53 & 4x1.8 GHz Cortex-A72)
Graphics processor GPU
  • Adreno 640
  • Adreno 510
GeekBench 4 Single Core * Unknown
  • 1376
GeekBench 4 Multi-Core * Unknown
  • 3146
GeekBench 4 RenderScript * Unknown
  • 3679
Antutu 8 score *
  • 421607
Unknown
GeekBench 4 Battery * Unknown
  • 2489
GeekBench 5 Single Core *
  • 709
  • 261
GeekBench 5 Multi-Core *
  • 2546
  • 770
General specs
General specs — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Release date
  • 2019
  • February
  • 2016
  • May
Colors
  • Mirror Black
  • Mirror Teal
  • Mirror White
  • Carmine Red
  • New Aurora Black
  • New Moroccan Blue
  • Gray
  • Silver
  • Gold
Historical recorded price Legacy catalogue value; date unknown. Not a current offer.
  • 770 EUR
  • 150 EUR
Body build
  • Front glass (Gorilla Glass 5)
  • Back glass (Gorilla Glass 6)
  • aluminum frame
  • Front glass
  • aluminum body
Communication and Connectivity
Communication and Connectivity — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
SIM card
  • Single SIM (Nano-SIM)Hybrid Dual SIM (Nano-SIM
  • dual stand-by)
  • Hybrid Dual SIM (Nano-SIM/ Micro-SIM
  • dual stand-by)
Network
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 (dual-SIM model only) -3G - HSDPA 850 / 900 / 1700(AWS) / 1800 / 1900 / 2100 -4G - LTE band 1(2100)
  • 2(1900)
  • 3(1800)
  • 4(1700/2100)
  • 5(850)
  • 7(2600)
  • 8(900)
  • 12(700)
  • 17(700)
  • 20(800)
  • 28(700)
  • 32(1500)
  • 38(2600)
  • 39(1900)
  • 40(2300)
  • 41(2500)
  • Show all network frequencies: -2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2 CDMA 800 / 1900 -3G - HSDPA 850 / 900 / 1900 / 2100 CDMA2000 1xEV-DO TD-SCDMA -4G - LTE band 1(2100)
  • 3(1800)
  • 7(2600)
  • 38(2600)
  • 39(1900)
  • 40(2300)
  • 41(2500)
Speed
  • HSPA 42.2/5.76 Mbps
  • LTE-A
  • HSPA
  • LTE
GPRS
  • Yes
  • Yes
Edge
  • Yes
  • Yes
Wi-Fi
  • Wi-Fi 802.11 a/b/g/n/ac
  • dual-band
  • Wi-Fi Direct
  • DLNA
  • hotspot
  • Wi-Fi 802.11 a/b/g/n/ac
  • dual-band
  • Wi-Fi Direct
  • DLNA
  • hotspot
GPS
  • Yes
  • with A-GPS
  • GLONASS
  • GALILEO
  • BDS
  • Yes
  • with A-GPS
  • GLONASS
  • BDS
USB
  • 3.1
  • Type-C 1.0 reversible connector
  • USB On-The-Go
  • microUSB 2.0
  • USB Host
Bluetooth
  • 5.0
  • A2DP
  • LE
  • aptX HD
  • 4.2
  • A2DP
  • LE
Harmful irradiation Unknown
  • SAR - 0.84 W/kg (head) 0.63 W/kg (body)
Music and Audio
Music and Audio — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Radio
  • FM radio
  • FM radio
  • recording
Others
  • 100% DCI-P3 -Dolby Vision -HDR10 -Always-on display
  • 32-bit/192kHz audio -DTS: X Surround Sound -Active noise cancellation with dedicated mic
  • Active noise cancellation with dedicated mic
Other features
Other features — specifications for G8s ThinQ, Mi Max.
SpecificationG8s ThinQMi Max
Dop
  • Sensors Fingerprint (rear-mounted)
  • accelerometer
  • gyro
  • proximity
  • compass
  • barometer - Fast battery charging 18W (Quick Charge 3.0) -Wireless charging
  • Sensors Fingerprint (rear-mounted)
  • accelerometer
  • gyro
  • proximity
  • compass
  • Infrared port - Versions: Global; Standard; Prime